Different processes are required according to the structure of the products. The processes that are used in our current products are Laser, SMT, THT, Manual Mounting, Coating, X-Ray, ICT/FCT, Milling Cutter and Final check Processes.
In this process, 2D-codes are printed on the cards (PCB, PCBA) by using laser and with burning method. The traceability of the product is achieved with this barcode. Also in the other processes, this code is taken as reference and the traceability of the product is made according to the card. The cards for which 2D-codes are generated with laser are automatically loaded to the magazines (carriers) at the output of the machine with the current machine system.
SMT Process is a process that accommodates five important processes. These processes are Printer(Solder Printing Machine),SPI (Solder Paste Inspection) Pick and Place (String), Reflow (Oven) and AOI (Optic control) processes.
The surface cleaning process of the PCBs is performed here.
The soldering work is performed here. Under the humidity and temperature controls, the soldering is made with an appropriate sieve on the soldering blocks located on the card.
The test for the height, area, volume, short-circuit and skewness of the solder applied on the block on the card is performed.
The placement of the SMT materials on the card is performed in this machine. The faulty material setting is prevented with a verification system. The materials are fed to the machine in a rapid and automated manner.
The press fit or through hole mounting materials are set on the cream solder during the SMT process.
It is the activation and integration of the solder with the solder block and material on the card at appropriate temperature and times. So the materials are soldered to the card. The process is conducted under nitrous atmosphere.
Performs 3D automated optic control. The setting or mounting completed cards are visually inspected in this process. Controls the presence, direction, skewness, height and soldering status of the materials and reports the errors, if any.
Means the through hole mounting technology and the setting and soldering of the legged materials are performed in this process. We can divide this process into four as Radial, Axial, Selective Soldering and Pin Inserter.
The surface cleaning process of the PCBs is performed here.
The soldering work is performed here. Under the humidity and temperature controls, the soldering is made with an appropriate sieve on the soldering blocks located on the card.
The test for the height, area, volume, short-circuit and skewness of the solder applied on the block on the card is performed.
The placement of the SMT materials on the card is performed in this machine. The faulty material setting is prevented with a verification system. The materials are fed to the machine in a rapid and automated manner.
The press fit or through hole mounting materials are set on the cream solder during the SMT process.
It is the activation and integration of the solder with the solder block and material on the card at appropriate temperature and times. So the materials are soldered to the card. The process is conducted under nitrous atmosphere.
Performs 3D automated optic control. The setting or mounting completed cards are visually inspected in this process. Controls the presence, direction, skewness, height and soldering status of the materials and reports the errors, if any.
It is used for applying protective, adhesive, coater, etc. materials at the points on the card according to the request of the customer.
The local protective coating process is performed according to the request of the customer in order to improve the resistance of the cards against the environmental factors.
3D controls of the required materials and areas of the cards are performed under X-Ray.
The electrical and functional tests of the cards are performed in this process. The values, polarity, presence, currents, voltages and functions of the materials are controlled in this process. The LED Tests are applied under functional tests and the colour, brightness and homogeneity checks are made.
It is used to separate the panelled PCBs from each other. This method is safe since no pressure is generated on the card.
The visual check is performed in this process. The scratched, cut, deformed card or materials that may occur on the lines or may be omitted are detected by means of this process.
The PCBs are set according to the request of the customer and packed per the instructions of the customer.
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